Solder paste column M705, flux, board washing water with absolute Alcoholic beverages; board washing water is used to clean up the solder residue immediately after repair; thermal gel (specification: Fujipoly SPG-30B) is utilized to smear the surface with the chip right after repair ；ball-planting steel mesh, solder absorption wire, https://louisicrhv.blogginaway.com/32078275/antminer-s19-hashboard-repair-an-overview